Method and system for controlling ultraviolet laser wafer cutting machine

• Main Authors: FU RONG, QIN XIAOMING, LIANG SHUZHI, ZHAN SHUPING
• Format: Patent
• Language: Chinese; English
• Published: 02.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The invention relates to the field of wafer cutting, in particular to an ultraviolet laser wafer cutting machine control method and system.The method comprises the following steps that an acquisition camera is controlled to move to a designated position; obtaining wafer image information corresponding to the uncut wafer raw material; determining Mack position information based on the wafer image information; target wafer position information is determined based on the Mack position information, and the number of the target wafer position information is multiple; corresponding target area position information on the wafer image information is obtained based on the target wafer position information, and the number of the target area position information is the same as that of the target wafer position information; and controlling the galvanometer to move to a wafer position corresponding to the target area position information for processing. The wafer cutting method has the effect of improving the machining pr