Satellite multi-layer communication cabin structure

• Main Authors: WANG YIHONG, WANG HAOPAN, TAO CHENG, LIU HUI, CUI JIATAO
• Format: Patent
• Language: Chinese; English
• Published: 30.05.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a satellite multi-layer communication cabin structure which comprises a multi-layer communication cabin, a communication cabin horizontal plate and a three-dimensional heat pipe for heat dissipation of horizontal plate equipment, and the multi-layer communication cabin comprises a grounding plate, a communication cabin south-north plate, a communication cabin south upper partition plate, a communication cabin south lower partition plate, a communication cabin north upper partition plate and a communication cabin north lower partition plate; the horizontal plate of the communication cabin is arranged in parallel to the direction of the opposite floor, and the horizontal plate is respectively connected with a communication cabin south-north plate, a communication cabin south-north upper partition plate and a communication cabin south-north lower partition plate to form a multi-layer communication cabin structure of the communication cabin; the ground plate, the horizontal plate and the