Wafer lifting device and cleaning equipment

The invention discloses a wafer lifting device and cleaning equipment, and the wafer lifting device comprises a first supporting assembly which is used for carrying out the at least two-point supporting of the end face of a wafer, so as to enable the wafer to stand laterally; the second supporting a...

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Bibliographic Details
Main Authors NAN JIANHUI, MA HONGSHUAI, ZHAO HONGYU, GAO SHAOFEI, WANG RUITING, ZHANG JINBIN
Format Patent
LanguageChinese
English
Published 26.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a wafer lifting device and cleaning equipment, and the wafer lifting device comprises a first supporting assembly which is used for carrying out the at least two-point supporting of the end face of a wafer, so as to enable the wafer to stand laterally; the second supporting assembly is used for supporting the wafer after rising, and the second supporting assembly avoids the first supporting assembly when rising to support the wafer; the lifting mechanism is connected with the first supporting assembly and the second supporting assembly and used for driving the first supporting assembly to drive the wafer to ascend from the first preset position to the second preset position; and the driving assembly is used for driving the second supporting assembly to drive the wafer to ascend from the second preset position to a third preset position after the wafer ascends to the second preset position, so that the wafer is separated from the first supporting assembly. According to the supporting de
Bibliography:Application Number: CN202310101720