Processing chamber, substrate processing method and processing device

• Main Authors: LI WEIMING, KANG XU, SHI SHUPENG, YAN DA, SHEN ANLEI
• Format: Patent
• Language: Chinese; English
• Published: 26.05.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a processing chamber, a substrate processing method and a substrate processing device. The processing chamber comprises a chamber body assembly and a chamber door assembly. The cavity assembly comprises a cavity; the cavity door assembly comprises a spraying plate and a cavity door, the spraying plate is arranged on the cavity door, when the cavity door assembly is closed, the spraying plate covers one end of the cavity, a treatment space is defined by the cavity and the spraying plate, and the spraying plate can introduce treatment gas into the treatment space. According to the processing chamber provided by the invention, the spraying plate covers the chamber body, so that the processing chamber and the internal structure thereof are simplified, and the internal space of the chamber body is increased under the condition that the processing chamber occupies the same use space, so that the chamber body can accommodate larger and more substrates, the processing capacity is improved, and