High-temperature-resistant polyimide as well as preparation method and application thereof
The invention discloses high-temperature-resistant polyimide as well as a preparation method and application thereof, and belongs to the technical field of material chemistry. The molecular structure of the high-temperature-resistant polyimide has a sulfonyl group, a carbonyl group and a rigid aroma...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
26.05.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses high-temperature-resistant polyimide as well as a preparation method and application thereof, and belongs to the technical field of material chemistry. The molecular structure of the high-temperature-resistant polyimide has a sulfonyl group, a carbonyl group and a rigid aromatic hydrocarbon unit at the same time, and due to the unique molecular structure, the high-temperature-resistant polyimide has high heat resistance, and meanwhile, the toughness and heat resistance of the bismaleimide resin composite material can be remarkably improved; the method has a wide application prospect in the fields of aerospace, precision machinery and the like.
本发明公开了一种耐高温聚酰亚胺及其制备方法和应用,属于材料化学技术领域。本发明的耐高温聚酰亚胺的分子结构中同时具有砜基基团、羰基基团与刚性芳香碳氢单元,独特的分子结构使其具有高耐热性的同时还能显著提高双马来酰亚胺树脂复合材料的韧性和耐热性能,在航天航空、精密机械等领域具有广阔的应用前景。 |
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Bibliography: | Application Number: CN202310184963 |