Implantable pressure sensor package
The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pres...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
23.05.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pressure sensor device; and a biocompatible layer, the biocompatible layer being applied over the transduction medium.
本发明提供一种可植入传感器装置，所述可植入传感器装置包括：传感器支撑基板；微机电系统(MEMS)压力传感器装置，所述微机电系统压力传感器装置安装到所述传感器支撑基板；换能介质，所述换能介质施加在所述压力传感器装置上方；以及生物相容性层，所述生物相容性层施加在所述换能介质上方。 |
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| AbstractList | The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pressure sensor device; and a biocompatible layer, the biocompatible layer being applied over the transduction medium.
本发明提供一种可植入传感器装置，所述可植入传感器装置包括：传感器支撑基板；微机电系统(MEMS)压力传感器装置，所述微机电系统压力传感器装置安装到所述传感器支撑基板；换能介质，所述换能介质施加在所述压力传感器装置上方；以及生物相容性层，所述生物相容性层施加在所述换能介质上方。 |
| Author | Y. KEDAR SIEMONS ALEXANDER H WU MH FRICK MARK STEVEN |
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| DocumentTitleAlternate | 可植入压力传感器封装 |
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| Snippet | The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical... |
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| Title | Implantable pressure sensor package |
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