Implantable pressure sensor package
The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pres...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
23.05.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pressure sensor device; and a biocompatible layer, the biocompatible layer being applied over the transduction medium.
本发明提供一种可植入传感器装置,所述可植入传感器装置包括:传感器支撑基板;微机电系统(MEMS)压力传感器装置,所述微机电系统压力传感器装置安装到所述传感器支撑基板;换能介质,所述换能介质施加在所述压力传感器装置上方;以及生物相容性层,所述生物相容性层施加在所述换能介质上方。 |
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Bibliography: | Application Number: CN202180063098 |