Implantable pressure sensor package

The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pres...

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Bibliographic Details
Main Authors SIEMONS ALEXANDER H, FRICK MARK STEVEN, Y. KEDAR, WU MH
Format Patent
LanguageChinese
English
Published 23.05.2023
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Summary:The present invention provides an implantable sensor device, the implantable sensor device comprising: a sensor support substrate; a micro electro mechanical system (MEMS) pressure sensor device mounted to the sensor support substrate; the transduction medium is applied to the upper part of the pressure sensor device; and a biocompatible layer, the biocompatible layer being applied over the transduction medium. 本发明提供一种可植入传感器装置,所述可植入传感器装置包括:传感器支撑基板;微机电系统(MEMS)压力传感器装置,所述微机电系统压力传感器装置安装到所述传感器支撑基板;换能介质,所述换能介质施加在所述压力传感器装置上方;以及生物相容性层,所述生物相容性层施加在所述换能介质上方。
Bibliography:Application Number: CN202180063098