COMPOSITIONS AND METHODS FOR INCREASING THE ADHESIVE OF IMAGES TO TREATED SUBSTRATES

In general, the present disclosure relates to compositions and methods for treating a substrate and for improving the adhesion of an image to the treated substrate, the present invention relates to systems and methods for treating substrates and, more particularly, to systems and methods for treatin...

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Bibliographic Details
Main Author VARNELL DANIEL F
Format Patent
LanguageChinese
English
Published 16.05.2023
Subjects
CINEMATOGRAPHY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
MAGNETOGRAPHY
PHOTOGRAPHY
PHYSICS
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Summary:In general, the present disclosure relates to compositions and methods for treating a substrate and for improving the adhesion of an image to the treated substrate, the present invention relates to systems and methods for treating substrates and, more particularly, to systems and methods for treating substrates and for increasing the adhesion of electrophotographic images to the treated substrates using a combination of a polytertiary amide, colloidal silica, and optionally a polymeric adhesive. 总体而言，本公开涉及用于处理基材和用于改进图像对经处理的基材的附着力的组合物和方法，并且更具体地涉及利用聚叔酰胺、胶态二氧化硅和任选的聚合物胶粘剂的组合来处理基材和用于提高电子照相图像对经处理的基材的附着力的系统和方法。
Bibliography:Application Number: CN202180061188