Manual stripping jig and stripping method for thinned wafer

• Main Authors: LIU AJUAN, HOU PENG, PENG FEI, ZHANG JING
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a manual stripping jig for a thinned wafer, which comprises a handle, one end of the handle is fixedly provided with a storage tray, and the storage tray is provided with a detachable porous slide glass. The invention also discloses a method for stripping by using the manual stripping jig for the thinned wafer, which comprises the following steps of: firstly, fixing the porous slide glass and the thinned wafer on the object placing disc, secondly, putting the stripping jig fixed with the thinned wafer into stripping liquid to carry out ultrasonic stripping, further soaking, cleaning and dewatering to obtain a stripped wafer, and finally, carrying out manual stripping on the thinned wafer by using the manual stripping jig for the thinned wafer. And inspecting the stripped wafer through a microscope. The manual stripping jig for the thinned wafer is simple in structure and convenient to disassemble and assemble, can be compatible with thinned wafers with different regular or irregular si