Prediction method of drawing force of solid adhesive and bonding method of solid adhesive

• Main Authors: ZENG WEILUN, QIN SHIHUI, WANG ZHONGPEI, WU CHUHUI
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention provides a method for predicting the drawing force of solid glue, which comprises the following steps of: measuring the true density of the solid glue to obtain the porosity of the solid glue; carrying out dielectric curing measurement on the solid glue to obtain the ionic viscosity of the solid glue; and predicting whether the drawing force of the solid glue meets the standard or not based on the porosity of the solid glue and the ionic viscosity of the solid glue. The invention further provides a bonding method of the solid adhesive. According to the method for predicting the drawing force of the solid glue, the drawing force of the solid glue is predicted on the basis of the porosity of the solid glue and the ionic viscosity of the solid glue, and the method has high accuracy. 本申请提供了一种固态胶的拉拔力的预测方法，包括以下步骤：测量所述固态胶的真密度，以得到所述固态胶的孔隙率；将所述固态胶进行介电固化测量，得到所述固态胶的离子粘度；基于所述固态胶的孔隙率及所述固态胶的离子粘度，预测所述固态胶的拉拔力是否符合标准。本申请还提供了一种固态胶的贴合方法。本申请提供的固态胶的拉拔力的预测方法基于固态胶的孔隙率和固态胶的离子粘度，预测了固态胶的拉拔力，该方法具有较高的准确性。