Silver coated copper powder and application thereof

• Main Author: DENG YUSHENG
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CASTING; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; POWDER METALLURGY; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; WORKING METALLIC POWDER

The invention provides silver-coated copper powder and application thereof, the silver-coated copper powder comprises flaky copper powder and a silver coating on the surface of the flaky copper powder, and the radius-thickness ratio of the flaky copper powder is (35: 1)-(200: 1). The silver-coated copper powder disclosed by the invention has good conductivity and use performance, and the conductivity and electromagnetic shielding performance of a conductive material prepared from the silver-coated copper powder can be improved. 本发明提供一种银包铜粉及其应用，所述银包铜粉包括片状铜粉、以及存在于所述片状铜粉表面的镀银层，所述片状铜粉的径厚比为35:1～200:1。本发明的银包铜粉具有良好的导电性和使用性能，能够提高采用该银包铜粉制成的导电材料的导电性和电磁屏蔽性能。