Wiring area anti-interference production device and method

• Main Authors: LIU XINGBO, GUO CONGQIU, SHI JINYUAN, SONG BO, XU WEIGUO
• Format: Patent
• Language: Chinese; English
• Published: 02.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a wire bonding area anti-interference production device, which comprises a workbench, a first transfer track, a second transfer track and a deflection track, and is characterized in that the first transfer track and the second transfer track are arranged on the workbench; the deflection rail is arranged between the first transfer rail and the second transfer rail, the deflection rail is rotationally arranged on the workbench, and a bearing plate is arranged on the deflection rail in a sliding mode and used for bearing the lead frame; when the deflection track rotates, the first transfer track and the second transfer track synchronously move towards the side deviating from the deflection track. According to the invention, after the first transfer track transfers the lead frame to the deflection track, the deflection track rotates to drive the lead frame to deflect at a certain angle on the horizontal plane, and in a die bonding process, when a wafer is transferred to a substrate of the