Process for producing smart card module for contactless smart cards

A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the ant...

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Bibliographic Details
Main Authors J. MUNDIGL, D. HOUDEAU
Format Patent
LanguageEnglish
Published 24.09.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED CIRCUITS
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
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Summary:A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
Bibliography:Application Number: CN19951095671