Bonding material, preparation method and semiconductor device

• Main Authors: CHEN XIAOYANG, YAO GUANGQIANG, YE ZHI, YAN BIN, ZHOU PEIGEN, SUN ZHIGUO, WANG YU, MENG TENGFEI, WANG YONGAN
• Format: Patent
• Language: Chinese; English
• Published: 02.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention relates to the technical field of semiconductors, and provides a bonding material, a preparation method and a semiconductor device, and the bonding material comprises printing ink, waterborne polyurethane modified alkyd resin, amino resin, a diluent, thermosetting resin, a plasticizer and an insulating material. The bonding material contains the ink, so that the toughness of the bonding material can be improved, and the problem that the bonded chip is cracked due to large stress after curing is avoided; meanwhile, the bonding material comprises the waterborne polyurethane modified alkyd resin, so that the gas release property of the bonding material can be reduced, and the influence on the performance of the bonded chip is avoided; moreover, the alkyd resin can increase the viscosity of the cured material, so that the bonding material has higher chip bonding strength; therefore, the usability of the adhesive material of the semiconductor chip can be improved. 本申请涉及半导体技术领域，提供一种粘接材料、制备方法及半导体器件，所述粘