Wafer cutting method, scribing machine and storage medium

• Main Authors: LEE CHANG-GON, NIU CHENGJIE
• Format: Patent
• Language: Chinese; English
• Published: 02.05.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention discloses a wafer cutting method, a scribing machine and a storage medium. The method is applied to the scribing machine, the scribing machine cuts a wafer in a double-cutting mode, in the double-cutting mode, the scribing machine uses two cutters to sequentially cut the same cutting channel, firstly, the current cutting channel is cut through a first cutter, and a first cutting mark is formed; if the cutting mark detection is executed and the offset between the first cutting mark and the preset cutting position of the current cutting way is obtained before the second cutter cuts the current cutting way, the current cutting way continues to be cut through the second cutter, and the offset is ignored in the cutting process; and after the second cutter completes cutting of the current cutting channel, the cutting position of the next cutting channel is calibrated according to the offset. The invention further discloses the scribing machine. In the embodiment of the invention, the situation that th