Electrode manufacturing method, electrode and semiconductor device

The invention provides an electrode manufacturing method, an electrode and a semiconductor device, and belongs to the field of semiconductor devices.The method comprises the steps that an electrode layer with the preset thickness is sputtered on the surface of a silicon substrate; exposure parameter...

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Bibliographic Details
Main Authors NI YE, CHEN XIAOYANG, YU HAIYANG, YAO GUANGQIANG, SUN ZHIGUO, MENG TENGFEI, WANG YONGAN
Format Patent
LanguageChinese
English
Published 28.04.2023
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Summary:The invention provides an electrode manufacturing method, an electrode and a semiconductor device, and belongs to the field of semiconductor devices.The method comprises the steps that an electrode layer with the preset thickness is sputtered on the surface of a silicon substrate; exposure parameters of a photoetching machine are adjusted, a photoresist pattern with the side wall of a slope structure is prepared on the surface of the electrode layer through the adjusted photoetching machine, and light emitted by the adjusted photoetching machine has a diffraction effect in the preparation process of photoresist; and according to the photoresist pattern and a preset etching process parameter adjustment scheme, etching the electrode layer through an etching machine to obtain an electrode pattern of which the side wall is of a slope structure. According to the method, the photoresist pattern with the side wall in the slope structure is prepared by utilizing the diffraction effect of light and adjusting the expos
Bibliography:Application Number: CN202310320076