Application of additive in improving high-temperature-resistant storage performance of solder paste

• Main Authors: LU HONGBO, TANG LI, LYU JINMEI, HE HUAN, XIE QIULI, QIN JUNHU, FANG SHU, ZHANG XIN, TAKENOBU
• Format: Patent
• Language: Chinese; English
• Published: 28.04.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to application of an additive in improving high-temperature-resistant storage performance of solder paste, the additive is formed by mixing two or three of 2, 4-diphenyl-4-methyl-1-pentene, 3-mercaptopropionic acid isooctyl ester and isobornyl methacrylate, and the additive is applied to the solder paste. The additive can effectively improve the high-temperature-resistant storage performance of the lead-free SnAgCu solder paste. 本发明涉及一种添加剂在提高锡膏耐高温储存性能中的应用，所述添加剂由2,4-二苯基-4-甲基-1-戊烯、3-巯基丙酸异辛酯、甲基丙烯酸异冰片酯中的两种或三种混合组成，将所述添加剂应用于锡膏中。本发明的添加剂可以有效提高无铅SnAgCu锡膏的耐高温储存性能。