Epoxy resin composition and application thereof

• Main Authors: CHEN JIANXIONG, GUO YONGJUN, WEN WENYAN
• Format: Patent
• Language: Chinese; English
• Published: 25.04.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides an epoxy resin composition and application thereof, and the epoxy resin composition comprises the following components by weight: 100 parts of epoxy resin; 3-6 parts of an accelerant; 5 to 15 parts of polyether polyol; 0.02 to 0.2 part of a nonionic fluorocarbon surfactant; 0.05 to 0.5 part of a fluorine-free surface auxiliary agent; and 50-80 parts of a solvent. After the epoxy resin composition is attached to the surface of a base material, the intrinsic contact angle of the surface of the base material can be reduced, fluorocarbon bonds in the non-ionic fluorocarbon surfactant enable the epoxy resin composition to have excellent surface migration ability, pits of microstructures on the surface of the base material can be filled, and the service life of the epoxy resin composition is prolonged. And a rough shape beneficial to completing Cassie/Wenzel wetting model conversion by the interface liquid is formed, so that the hysteresis of a contact angle between the interface liquid and t