SYSTEM WITH HEATED VALVE MANIFOLD ASSEMBLY AND METHOD OF MANUFACTURING SAME

• Main Authors: SEIDL MARKUS, ESHELMAN DANIEL C, FONTANA CARLOS DAVID, FATIMA YANIV, PILZ THOMAS W
• Format: Patent
• Language: Chinese; English
• Published: 21.04.2023
• Subjects: ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY

The present invention relates to a system for semiconductor manufacturing having at least one heated valve manifold assembly, the assembly comprising: a thermally conductive plate having a total surface area, the thermally conductive plate having a first side and a second side; at least one heater in contact with the at least one thermally conductive plate; a valve manifold including a plurality of valves and conduits; the plurality of valves and conduits have a total surface area, wherein a portion of the surface area of the plurality of valves and conduits is in contact with the at least one thermally conductive plate; and one or more thermal insulation layers covering (i) a majority of a surface area of the plurality of valves and conduits, where the portion is in contact with the at least one thermally conductive plate, (ii) the at least one heater in contact with the at least one thermally conductive plate, and (iii) a majority of a surface area of the at least one thermally conductive plate. 本发明涉及一种用于半导