LED packaging method

The invention discloses an LED packaging method. The LED packaging method comprises the following steps that an LED wafer is fixed to a placement position on a substrate; arranging a hydrophobic material on the substrate around the placement position; and dispensing glue on the LED wafer, so that th...

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Bibliographic Details
Main Author LIN ZHONGZHI
Format Patent
LanguageChinese
English
Published 14.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses an LED packaging method. The LED packaging method comprises the following steps that an LED wafer is fixed to a placement position on a substrate; arranging a hydrophobic material on the substrate around the placement position; and dispensing glue on the LED wafer, so that the LED wafer is coated with a glue layer formed by curing the glue solution. According to the LED packaging method provided by the invention, the glue overflowing condition during glue dispensing of the LED wafer can be limited, so that the color difference phenomenon of the LED wafer is improved. 本申请公开了一种LED封装方法，包括如下步骤：将LED晶片固定于基板上的放置位；在基板上围绕放置位设置疏水材料；对LED晶片点胶，以使LED晶片外包裹一层胶液固化形成的胶层。本申请的LED封装方法能够限制LED晶片点胶时的溢胶情况，从而改善LED晶片的色差现象。
Bibliography:Application Number: CN202310095320