Method of mounting wire bonding tool on wire bonding system and related mounting tool and system

• Main Authors: BRUNER JOHN W, SCHULZE GARY W, SHAH ANKUR
• Format: Patent
• Language: Chinese; English
• Published: 14.04.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method of mounting a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with a mounting tool; (b) engaging the wire bonding tool in an aperture of a transducer of the wire bonding system while the wire bonding tool is held by the mounting tool; (c) fixing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the mounting tool. 提供一种将焊线工具安装在焊线系统上的方法。方法包括以下步骤：(a)利用安装工具保持焊线工具；(b)在焊线工具由安装工具保持的同时，将焊线工具接合在焊线系统的换能器的孔口中；(c)使焊线工具在孔口中固定；以及(d)使焊线工具从安装工具释放。