Conductive hybrid, hybrid condensation type organic silicon conductive adhesive prepared from conductive hybrid and preparation method of conductive hybrid

• Main Authors: HONG ZHANPENG, ZHOU BOXIONG, LUO YUANZHANG, JIANG JINBO, DAI FEILIANG, FU ZI'EN
• Format: Patent
• Language: Chinese; English
• Published: 07.04.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention relates to a conductive hybrid, a hybrid condensation type organosilicon conductive adhesive prepared by using the conductive hybrid and a preparation method of the conductive hybrid. The conductive hybrid is prepared by mixing 40-50 parts by weight of amino silicon oil, 30-40 parts by weight of a conductive polymer and 100-200 parts by weight of a solvent and then dropwise adding a mixed solution of 10-20 parts by weight of the solvent and 2.0-3.0 parts by weight of a coupling agent for synthetic reaction, wherein the dropwise adding of the mixed solution is controlled to be completed within 20-30 min, the reaction temperature is controlled to be 20-50 DEG C, and the reaction time is 60-80 min. The common form of physically adding conductive powder into a dispersed phase is broken through, the conductivity of a modified continuous phase is adopted, a polymer with a conductive property is successfully introduced into the continuous phase of condensed organic silica gel, and the conductivity of t