Reflow soldering clamp for chip processing

• Main Authors: ZHANG YANPO, ZHANG FAN
• Format: Patent
• Language: Chinese; English
• Published: 07.04.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a reflow soldering fixture for chip processing, and relates to the technical field of soldering, the reflow soldering fixture comprises a soldering plate, the top of the soldering plate is fixedly connected with a supporting rod, a sliding rod is arranged above the soldering plate, a reflow soldering device is arranged above the soldering plate, and the top of the soldering plate is fixedly connected with a soldering frame. When a chip is placed in the welding frame, an electric push rod pulls a sliding rod to move upwards on the surface of a supporting rod, and the sliding rod pulls a clamping part to move upwards through a top plate, so that the clamping part moves above the welding frame, and the chip is conveniently placed in the welding frame for welding work; the extension degree of the clamping component is adjusted through the adjusting component so that the clamping force of the clamping component can be adjusted, the positioning component is arranged in the welding frame, the