Sensor
The invention discloses a sensor which comprises an external packaging structure, a breathable film, a microphone chip and a pressure chip. A mounting cavity is formed in the external packaging structure, and a sound hole is formed in one cavity wall of the mounting cavity; the breathable film is ar...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
04.04.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a sensor which comprises an external packaging structure, a breathable film, a microphone chip and a pressure chip. A mounting cavity is formed in the external packaging structure, and a sound hole is formed in one cavity wall of the mounting cavity; the breathable film is arranged in the mounting cavity to divide the mounting cavity into a first chamber and a second chamber, the first chamber is communicated with the sound hole, and the breathable film is used for adsorbing harmful substances in airflow; the microphone chip is arranged in the first cavity and is electrically connected to the external packaging structure; the pressure chip is arranged in the second cavity and is electrically connected to the external packaging structure. According to the technical scheme, the technical problems that harmful substances are deposited on the aluminum bonding pad of the pressure chip, so that the aluminum bonding pad is corroded, and the pressure performance is abnormal and even fails can |
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Bibliography: | Application Number: CN202211458511 |