Vertical power supply and distribution framework of cluster type chip system

• Main Authors: WANG QIDONG, FANG ZHIDAN, HOU FENGZE, DING FEI, YOU XIANG'AN
• Format: Patent
• Language: Chinese; English
• Published: 04.04.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SYSTEMS FOR STORING ELECTRIC ENERGY

The invention discloses a vertical power supply and distribution framework of a clustered chip system, belongs to the technical field of microelectronic packaging, and solves the layout problem that a power supply and distribution module of the clustered chip system is difficult to place at a short distance or the problem that the clustered chip system cannot realize short-distance power supply and distribution in the prior art. In the framework, a load chip and a power supply and distribution module are stacked in a direction perpendicular to a circuit board; the power supply and distribution module comprises an external input layer, a conversion layer and a vertical interface layer which are vertically stacked and connected in sequence from bottom to top; the number of the power supply and distribution modules and the number of the load chips are both multiple, the number of the circuit board is one, the circuit board serves as a bearing and interconnection substrate of the multiple load chips, and an inter