LED support and preparation method and device thereof

• Main Authors: LI YURONG, LIANG PINGXIA, MAI JIA'ER, LI DANWEI, ZHU MINGJUN, WU CANBIAO
• Format: Patent
• Language: Chinese; English
• Published: 04.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an LED support which comprises a substrate, an internal electrode, a heat dissipation bonding pad, an electrode bonding pad and a solder mask layer, the electrode bonding pad comprises a top connecting layer and a bottom electrode layer which are stacked, the top connecting layer is connected with the back face of the substrate and provided with a connecting part which extends towards the heat dissipation bonding pad and is connected to a conductive through hole in the substrate, and the bottom electrode layer is connected with the bottom electrode layer. The connecting part is located between the heat dissipation bonding pad and the bottom electrode layer, and the distance between the bottom electrode layer and the heat dissipation bonding pad is larger than that between the connecting part and the heat dissipation bonding pad; and the solder mask layer is filled in a groove formed among the back surface of the substrate, the electrode bonding pad and the heat dissipation bonding pad