Semiconductor device and forming method thereof

• Main Authors: SU BO, ZHANG GAOYING, OH HAN-SU, YE YIZHOU
• Format: Patent
• Language: Chinese; English
• Published: 04.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a semiconductor device and a forming method thereof, and the method comprises the steps: providing a substrate which comprises a device region and a mark region; forming a plurality of first alignment mark structures on the surface of the mark area; performing first patterning by taking the first alignment mark structure as a reference, and forming a first device structure in the device region; and performing second patterning by taking the first alignment mark structure as a reference, and forming a second device structure in the device region. Therefore, the whole technological process is simplified, low-frequency noise is reduced, and the alignment accuracy of photoetching is improved. 半导体器件及其形成方法，其中一种半导体器件形成方法，包括：提供衬底，所述衬底包括器件区和标记区；在所述标记区表面形成若干第一对准标记结构；以所述第一对准标记结构为基准进行第一图形化，在所述器件区内形成第一器件结构；以所述第一对准标记结构为基准进行第二图形化，在所述器件区内形成第二器件结构。从而，简化了整体工艺流程，减少产生低频噪声，提高了光刻的对准准确度。