Ceramic-based electrical interconnection feed-through substrate and preparation method thereof

• Main Authors: WANG LONGCHUN, WEN DONGYANG, TU KEJUN, GUO ZHEJUN, LIU JINGQUAN
• Format: Patent
• Language: Chinese; English
• Published: 04.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CONDUCTORS; DIAGNOSIS; ELECTRICITY; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; INSULATORS; MEDICAL OR VETERINARY SCIENCE; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURGERY

The invention provides a ceramic-based electrical interconnection feed-through substrate and a preparation method thereof, and the substrate comprises a ceramic substrate which is internally provided with an electrical interconnection micro-column array formed by conductive micro-columns; the upper insulating layer is positioned above the ceramic substrate; the lower insulating layer is positioned below the ceramic substrate; through hole arrays formed by a plurality of insulating layer through holes are arranged in the upper insulating layer and the lower insulating layer, the positions of the insulating layer through holes correspond to the positions of the conductive micro-columns, and the diameter of the insulating layer through holes is smaller than that of the conductive micro-columns; the upper bonding pad is located above the upper insulating layer and fills the insulating layer through holes in the upper insulating layer and gaps between the upper insulating layer and the conductive micro columns; an