LED chip mass transfer method, display panel and display device

The invention relates to a mass transfer method for LED chips, and the method comprises the steps: preparing a transfer template, and enabling the surface of one side of the transfer template to be provided with a plurality of microstructures in a protruding manner; preparing a plurality of LED epit...

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Bibliographic Details
Main Authors XIAO JUNLONG, ZHAI FENG
Format Patent
LanguageChinese
English
Published 31.03.2023
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Summary:The invention relates to a mass transfer method for LED chips, and the method comprises the steps: preparing a transfer template, and enabling the surface of one side of the transfer template to be provided with a plurality of microstructures in a protruding manner; preparing a plurality of LED epitaxy on one side of the transfer template, wherein the LED epitaxy is arranged on the two opposite sides of each microstructure; respectively preparing LED chips on the plurality of LED epitaxy layers; and stripping the LED chips on the transfer template to a display backboard by laser. According to the mass transfer method, the problem that the overall transfer efficiency of the LED chips is low due to the fact that the mass transfer efficiency of the LED chips is limited by the photomask is solved. The invention further provides a display panel and a display device with the display panel. 本申请涉及一种LED芯片的巨量转移方法,所述巨量转移方法包括:制备转移模板,所述转移模板的一侧表面凸设有多个微结构;在所述转移模板的一侧制备多个LED磊晶,每个所述微结构的相对两侧具有所述LED磊晶;在多个所述LED磊晶上分别制备LED芯片;激光剥离所述
Bibliography:Application Number: CN202111136127