Constructing in-situ inductor structures in power plane
An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly, and a method of manufacturing an inductor structure. The inductor structure includes: an electrical conductor; and a magnetic structure comprising a non-conductive magnetic material, in w...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
28.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly, and a method of manufacturing an inductor structure. The inductor structure includes: an electrical conductor; and a magnetic structure comprising a non-conductive magnetic material, in which: one of the magnetic structure or the electrical conductor surrounds the other of the magnetic structure or the electrical conductor to thereby form an inductor structure; and at least one of the electrical conductor or the magnetic structure has a particulate microstructure comprising randomly distributed particles, the randomly distributed particles exhibiting substantially non-linear particle-to-particle boundaries between each other.
一种电感器结构、封装衬底、集成电路设备、集成电路设备组件以及制造电感器结构的方法。电感器结构包括:导电体;以及磁性结构,包括非导电磁性材料,其中:磁性结构或导电体中的一个环绕磁性结构或导电体中的另一个以由此形成电感器结构;并且导电体或磁性结构中的至少一个具有粒状微结构,该粒状微结构包括随机分布的颗粒,所述随机分布的颗粒彼此之间呈现基本上非线性的颗粒与颗粒边界。 |
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Bibliography: | Application Number: CN202211011406 |