Electronic device and manufacturing method thereof

• Main Authors: GAO KEYI, ZENG HONGYI
• Format: Patent
• Language: Chinese; English
• Published: 21.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an electronic device. The electronic device comprises a first metal layer, a first insulating layer, a second metal layer and a second insulating layer, the first insulating layer is arranged on the first metal layer, the second metal layer is arranged on the first insulating layer, and the second insulating layer is arranged between the second metal layer and the first insulating layer. The second metal layer is electrically connected with the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer. 本发明提供了一种电子装置，其包括一第一金属层、一第一绝缘层、一第二金属层以及一第二绝缘层。第一绝缘层设置在第一金属层上，第二金属层设置在第一绝缘层上，第二绝缘层设置在第二金属层与第一绝缘层之间。第二金属层透过第一绝缘层的一第一开口及第二绝缘层的一第二开口与第一金属层电性连接。