Processing technology of phenolic resin-based high-temperature-resistant circuit board

• Main Authors: LIU TONGFA, ZHANG BINBIN, ZHANG JIYOU, LIAO WEIGUANG, ZHU LIMING, FANG ZHAOPING, WEI WEI, CHO WANG HYUN
• Format: Patent
• Language: Chinese; English
• Published: 21.03.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention relates to the technical field of copper-clad plates, in particular to a processing technology of a phenolic resin-based high-temperature-resistant circuit board. Firstly, alpha-naphthol is used for replacing part of phenol, a naphthalene ring with a double-benzene-ring structure is introduced into a resin system, the temperature resistance is improved, meanwhile, the defects of a cross-linked network are reduced, the mechanical strength is improved, siloxane is further introduced into the phenolic resin, and a silicon-oxygen bond has high bond energy, so that the temperature resistance of the phenolic resin is improved. The hydrophobic property of the phenolic resin can be effectively reduced, and the flexibility of the system is effectively improved, so that the brittle failure phenomenon caused by overlarge rigidity is avoided; meanwhile, branched modified epoxy resin of a branched structure is further prepared, the dispersity of the nano antimony trioxide is enhanced, a more complex coach ne