Processing technology of phenolic resin-based high-temperature-resistant circuit board
The invention relates to the technical field of copper-clad plates, in particular to a processing technology of a phenolic resin-based high-temperature-resistant circuit board. Firstly, alpha-naphthol is used for replacing part of phenol, a naphthalene ring with a double-benzene-ring structure is in...
Saved in:
Main Authors | , , , , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
21.03.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention relates to the technical field of copper-clad plates, in particular to a processing technology of a phenolic resin-based high-temperature-resistant circuit board. Firstly, alpha-naphthol is used for replacing part of phenol, a naphthalene ring with a double-benzene-ring structure is introduced into a resin system, the temperature resistance is improved, meanwhile, the defects of a cross-linked network are reduced, the mechanical strength is improved, siloxane is further introduced into the phenolic resin, and a silicon-oxygen bond has high bond energy, so that the temperature resistance of the phenolic resin is improved. The hydrophobic property of the phenolic resin can be effectively reduced, and the flexibility of the system is effectively improved, so that the brittle failure phenomenon caused by overlarge rigidity is avoided; meanwhile, branched modified epoxy resin of a branched structure is further prepared, the dispersity of the nano antimony trioxide is enhanced, a more complex coach ne |
---|---|
Bibliography: | Application Number: CN202211699096 |