Substrate including inductor and capacitor in encapsulation layer

• Main Authors: KIM JONGHAE, CHIDAMBARAM PERIANNAN, SHAH MEHUL
• Format: Patent
• Language: Chinese; English
• Published: 14.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A package includes a power amplifier and a substrate coupled to the power amplifier. The substrate includes an encapsulation layer, a capacitor device in the encapsulation layer, an inductor in the encapsulation layer, at least one first dielectric layer coupled to a first surface of the encapsulation layer, and a plurality of first interconnects coupled to the first surface of the encapsulation layer. A plurality of first interconnects is at least in the at least one first dielectric layer. A plurality of first interconnects are coupled to the capacitor device and the inductor. The inductor and the capacitor device are configured to be electrically coupled together to operate as elements of a matching network of the power amplifier. The capacitor device is configured to be coupled to ground. 一种封装，包括功率放大器和被耦合到功率放大器的衬底。衬底包括包封层、位于包封层中的电容器器件、位于包封层中的电感器、被耦合到包封层的第一表面的至少一个第一电介质层，以及被耦合到包封层的第一表面的多个第一互连。多个第一互连至少位于至少一个第一电介质层中。多个第一互连被耦合到电容器器件和电感器。电感器和电容器器件被配置为被电耦合在一起，以作为功率放大器的匹配网络的元件来操作。电容器器件被配置为被耦合到地。