Methods, systems, and apparatus for chucking operations using adjusted chucking voltages when processing shifts occur

• Main Authors: BOYD MICHAEL, BOYD WENDELL G JR
• Format: Patent
• Language: Chinese; English
• Published: 14.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods, systems, and devices are disclosed for chucking operations using an adjusted chucking voltage when a process shift occurs. In one embodiment, a method includes performing a first processing operation on a substrate in a processing chamber. The first processing operation includes applying a chucking voltage to an electrostatic chuck (ESC) in a processing chamber while the substrate is supported on the ESC. The method includes determining that a processing shift has occurred. Determining that the process shift has occurred includes one or more of determining that a center of the substrate has moved a post-process shift relative to a pre-process position that is center prior to the first process operation, or determining that a defect count of a backside surface of the substrate exceeds a defect threshold. The method includes determining an adjusted chucking voltage based on an occurrence of the processing shift. 公开了在发生处理移位时使用经调整的卡紧电压进行卡紧操作的方法、系统和装置。在一个实施方式中，一种方法包括在处理腔室中对基板进行第一处理操作。第一处理操作包括在基板被支撑在ESC上时，