Method for forming high-aspect-ratio porous titanium electrode of miniature supercapacitor

• Main Authors: WANG XIAOHONG, LI-ZHANG SHANHAO, XU MINGHAO
• Format: Patent
• Language: Chinese; English
• Published: 14.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

The invention provides a method for forming a high-aspect-ratio porous titanium electrode of a miniature supercapacitor, which comprises the following steps of: photoetching, namely forming a first photoresist layer and a second photoresist layer which are adhered to each other on a substrate through photoetching, and along the direction parallel to the substrate, enabling the sectional area of the first photoresist layer to be smaller than that of the second photoresist layer; sputtering, namely performing physical vapor deposition on the titanium-based alloy to form a titanium-based alloy electrode; and an etching step: selectively etching the titanium-based alloy electrode by using an etching agent so as to remove other elements except titanium in the titanium-based alloy electrode and form the high aspect ratio porous titanium electrode. According to the method, the high-aspect-ratio porous titanium electrode of the micro supercapacitor and the patterning of the high-aspect-ratio porous titanium electrode