Substrate polishing system and substrate polishing method

• Main Author: SON JI-HOON
• Format: Patent
• Language: Chinese; English
• Published: 07.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a substrate grinding system and a substrate grinding method. A substrate polishing system according to one embodiment includes a plurality of polishing devices that sequentially polish a substrate, and each of the polishing devices includes: a polishing plate that polishes the substrate; a data collection unit that collects a signal generated during the polishing of the substrate; a data analysis unit that analyzes the collected signal and detects the thickness of the substrate; and a polishing end point detection unit that determines a polishing end point of the substrate according to the thickness of the detected substrate, the plurality of polishing devices share data between each other, and the data obtained from one polishing device can be reflected in the substrate thickness detection process of the next polishing device based on the polishing sequence of the substrate. 公开了一种基板研磨系统及基板研磨方法。根据一个实施例的基板研磨系统，包括多个研磨装置，其依次对基板进行研磨，并且各个研磨装置包括：研磨平板，其对基板进行研磨；数据收集部，其收集在基板的研磨过程中产生的信号；数据分析部，其对