Electrodeposition of metal on substrate using ionically resistive ionically permeable elements or shields spatially tailored as die-level patterns

• Main Authors: KUMAR SANTOSH, BUCKALEW BRYAN L, CAI LIPING, MAYER STEVEN T, FORTNER JAMES ISAAC, BANIK STEPHEN J II, RASH ROBERT, GRAHAM GABRIEL HAY
• Format: Patent
• Language: Chinese; English
• Published: 07.03.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

An apparatus for electroplating metal on a semiconductor substrate with high control over the electroplating thickness at the die level includes an ionically resistive, ionically permeable element (e.g., a plate with channels) that allows an ionic current to flow through the element to the substrate during electroplating, and that allows the substrate to flow through the element during electroplating. Wherein the element comprises a plurality of regions, each region having a varying pattern of local resistance, and wherein the varying pattern of local resistance is repeated in at least two regions. A method of electroplating, the method comprising: providing a semiconductor substrate into an electroplating apparatus, where the electroplating apparatus comprises an ionically resistive, ionically permeable element or mesh shield having a pattern associated with a feature pattern on the substrate, while maintaining the pattern on the substrate in spatial alignment with the pattern of the element or lattice shiel