Method and apparatus for processing electrostatic chuck

Methods and apparatus (devices) are described for processing electrostatic chucks under controlled process conditions, including, for example, processing electrostatic chucks during the step of curing an adhesive forming a bond between two layers of the electrostatic chucks. 描述用于在受控工艺条件下处理静电卡盘，包含(例如...

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Bibliographic Details
Main Authors DONNELL STEVEN, LIU YAN, MINSKI COREY, PYDI CHIRANJEEVI, MERCELLA STEFANO, MUNOZ CHRISTOPHER, RICHARD NICOLAS
Format Patent
LanguageChinese
English
Published 07.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods and apparatus (devices) are described for processing electrostatic chucks under controlled process conditions, including, for example, processing electrostatic chucks during the step of curing an adhesive forming a bond between two layers of the electrostatic chucks. 描述用于在受控工艺条件下处理静电卡盘，包含(例如)用于在固化在所述静电卡盘的两个层之间形成接合的粘合剂的步骤期间处理静电卡盘的方法及设备(装置)。
Bibliography:Application Number: CN202211063859