Regenerative semiconductor wafer laser cutting device

• Main Author: CAI YAOYU
• Format: Patent
• Language: Chinese; English
• Published: 07.03.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CONVEYING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; HANDLING THIN OR FILAMENTARY MATERIAL; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SHOP CONVEYOR SYSTEMS; SOLDERING OR UNSOLDERING; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to the field of wafer production equipment, in particular to a regenerative semiconductor wafer laser cutting device which comprises an operation cabinet, a workbench, a running track, a material conveying assembly, a cutting assembly and a containing groove. A control system is arranged at the front end of the operation cabinet; a working cavity is transversely formed in the middle of the operation cabinet; the workbench is arranged at the bottom of the working cavity, and supporting columns are fixedly arranged on the two sides of the workbench. The running track comprises a first transverse track and a second transverse track which are oppositely laid at the upper ends of the supporting columns and fixedly connected with the supporting columns; the material conveying assembly is fixedly installed on the operation track, is in sliding fit with the operation track and is electrically connected with the control system. The cutting assembly is fixedly installed on the top of the working c