Semiconductor device and electronic system

• Main Authors: SHIN SEUNG JUN, HAN JEE-HOON, SON YOON-HWAN, KIM HYUNG-JIN, SHIN MIN-SOO, SHIN JOONG-SHIK
• Format: Patent
• Language: Chinese; English
• Published: 03.03.2023
• Subjects: ELECTRICITY

A semiconductor device includes: a lower step connection portion at a first vertical height on a substrate; an upper stepped connection portion on the substrate at a second vertical height higher than the first vertical height; a lower insulating block contacting each of the plurality of lower conductive pad portions at a first vertical height; an upper insulating block contacting each of the plurality of upper conductive pad portions at a second vertical height; an intermediate insulating film between the lower insulating block and the upper insulating block at a third vertical height between the first vertical height and the second vertical height; and a first plug structure extending in the vertical direction into the lower stepped connection portion, the middle insulating film, and the upper insulating block, in which a width of the first plug structure in the horizontal direction is maximum at a third vertical height. 一种半导体器件，包括：下阶梯连接部，在衬底上位于第一竖直高度处；上阶梯连接部，在衬底上位于高于第一竖直高度的第二竖直高度处；下绝缘块，在第一竖直高度处接触多个下导电焊盘部中的