Preparation method of multilayer ceramic circuit board with double-sided cavity structure

• Main Authors: SHEN YITING, PANG JINBIAO, DOU ZHANMING, YUAN SHIFENG, SHU GUOJIN, LIU KAI, HAN YUCHENG
• Format: Patent
• Language: Chinese; English
• Published: 03.03.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a preparation method of a multilayer ceramic circuit board with a double-sided cavity structure, and belongs to the field of electronic components. Comprising the following steps: performing punching, hole filling, circuit printing, drying and cavity opening on a green tape; printing an adhesive layer on the surface of the green ceramic chip; aligning and laminating the raw ceramic tapes printed with the adhesive, and pressing into a ceramic green body; wrapping a thin soft silica gel pad with a preservative film, placing the thin soft silica gel pad on a flat stainless steel plate, placing the laminated ceramic green body on the soft silica gel, placing another piece of soft silica gel wrapped with the preservative film on the ceramic green body, and performing low-pressure isostatic pressing after vacuum packaging; performing hot cutting to obtain a single double-sided cavity structure multilayer ceramic circuit board green body; and sintering to form the multilayer ceramic circuit b