Substrate processing method
The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on the chuck table to restrain the wafer portion on the chuck table; a spray suction arm module which sprays the processing liquid to the wafer...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
17.02.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on the chuck table to restrain the wafer portion on the chuck table; a spray suction arm module which sprays the processing liquid to the wafer part and sucks foreign matters from the processing liquid; unloading the annular cover portion from the chuck table; and the spraying arm module sprays cleaning liquid to the wafer part to clean the wafer part.
本发明的基板处理方法的特征在于，包括如下的步骤：将晶圆部放置在卡盘台；将环形盖部装载于卡盘台，以将晶圆部限制在卡盘台；喷射吸入臂模块向晶圆部喷射处理液，且从处理液吸入异物；从卡盘台卸载环形盖部；以及喷射臂模块向晶圆部喷射清洗液来清洗晶圆部。 |
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| AbstractList | The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on the chuck table to restrain the wafer portion on the chuck table; a spray suction arm module which sprays the processing liquid to the wafer part and sucks foreign matters from the processing liquid; unloading the annular cover portion from the chuck table; and the spraying arm module sprays cleaning liquid to the wafer part to clean the wafer part.
本发明的基板处理方法的特征在于，包括如下的步骤：将晶圆部放置在卡盘台；将环形盖部装载于卡盘台，以将晶圆部限制在卡盘台；喷射吸入臂模块向晶圆部喷射处理液，且从处理液吸入异物；从卡盘台卸载环形盖部；以及喷射臂模块向晶圆部喷射清洗液来清洗晶圆部。 |
| Author | BAEK SEUNG-DAE XU JINDONG LI QIANGYUAN SON JAE-HWAN KIM JIN-WON |
| Author_xml | – fullname: KIM JIN-WON – fullname: LI QIANGYUAN – fullname: BAEK SEUNG-DAE – fullname: XU JINDONG – fullname: SON JAE-HWAN |
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| DocumentTitleAlternate | 基板处理方法 |
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| Notes | Application Number: CN202210763589 |
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| RelatedCompanies | ZEUS CO., LTD |
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| Snippet | The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | Substrate processing method |
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