Substrate processing method

The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on the chuck table to restrain the wafer portion on the chuck table; a spray suction arm module which sprays the processing liquid to the wafer...

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Bibliographic Details
Main Authors KIM JIN-WON, LI QIANGYUAN, BAEK SEUNG-DAE, XU JINDONG, SON JAE-HWAN
Format Patent
LanguageChinese
English
Published 17.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The substrate processing method is characterized by comprising the following steps: placing a wafer part on a chuck table; loading an annular cover portion on the chuck table to restrain the wafer portion on the chuck table; a spray suction arm module which sprays the processing liquid to the wafer part and sucks foreign matters from the processing liquid; unloading the annular cover portion from the chuck table; and the spraying arm module sprays cleaning liquid to the wafer part to clean the wafer part. 本发明的基板处理方法的特征在于，包括如下的步骤：将晶圆部放置在卡盘台；将环形盖部装载于卡盘台，以将晶圆部限制在卡盘台；喷射吸入臂模块向晶圆部喷射处理液，且从处理液吸入异物；从卡盘台卸载环形盖部；以及喷射臂模块向晶圆部喷射清洗液来清洗晶圆部。
Bibliography:Application Number: CN202210763589