Discharge method, discharge system and substrate treatment equipment

• Main Authors: KIM DAE-SOO, CHOI JI-MIN
• Format: Patent
• Language: Chinese; English
• Published: 17.02.2023
• Subjects: BLASTING; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PIPE-LINE SYSTEMS; PIPE-LINES; SEPARATION; STORING OF DISTRIBUTING GASES OR LIQUIDS; TRANSPORTING; WEAPONS

The invention provides a discharge method, a discharge system and a substrate treatment apparatus. The discharge method includes: discharging a discharge product including a first discharge gas and a solid by-product into an interior of a collection device from a process chamber in which a substrate treatment process is performed in a vacuum state; solid by-products are collected in a collecting device; introducing a portion of the second exhaust gas discharged from the load lock chamber into a collection device; and vaporizing the solid by-product in the collection device, and discharging the vaporized solid by-product to the outside of the collection device. 本公开提供排放方法、排放系统和基底处理设备。排放方法包括：将包括第一排放气体和固体副产物的排放产物从在真空状态下执行基底处理工艺的工艺腔排放到收集装置的内部中；在收集装置中收集固体副产物；将从装载锁定腔排放出的第二排放气体的一部分引入到收集装置中；以及在收集装置中使固体副产物汽化，并且将汽化的固体副产物排放到收集装置的外部。