Ultrahigh-frequency electromagnetic wave transmitting/receiving device
The embodiment of the invention relates to an ultrahigh frequency electromagnetic wave transmitting/receiving device. The present specification relates to an electromagnetic wave transmitting/receiving device including a multi-layer organic substrate, an integrated circuit chip, a flip chip assemble...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
10.02.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The embodiment of the invention relates to an ultrahigh frequency electromagnetic wave transmitting/receiving device. The present specification relates to an electromagnetic wave transmitting/receiving device including a multi-layer organic substrate, an integrated circuit chip, a flip chip assembled on the multi-layer organic substrate, and a package including a first cavity containing the multi-layer organic substrate and the integrated circuit chip and communicating with a second cavity forming an electromagnetic wave waveguide through a channel.
本公开的实施例涉及超高频电磁波发射/接收器件。本说明书涉及一种电磁波发射/接收器件,其包括:多层有机衬底、集成电路芯片、组装在多层有机衬底上的倒装芯片、包括第一腔体的封装,该第一腔体包含多层有机衬底和集成电路芯片,并且通过通道与形成电磁波波导的第二腔体连通。 |
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Bibliography: | Application Number: CN202210915317 |