Ultrahigh-frequency electromagnetic wave transmitting/receiving device

The embodiment of the invention relates to an ultrahigh frequency electromagnetic wave transmitting/receiving device. The present specification relates to an electromagnetic wave transmitting/receiving device including a multi-layer organic substrate, an integrated circuit chip, a flip chip assemble...

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Bibliographic Details
Main Authors CAILLE JEAN-FRANCOIS, GANESIERO, FRANCESCO, FIORESE, VINCENZO, LAPORTE FRANCOIS
Format Patent
LanguageChinese
English
Published 10.02.2023
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Summary:The embodiment of the invention relates to an ultrahigh frequency electromagnetic wave transmitting/receiving device. The present specification relates to an electromagnetic wave transmitting/receiving device including a multi-layer organic substrate, an integrated circuit chip, a flip chip assembled on the multi-layer organic substrate, and a package including a first cavity containing the multi-layer organic substrate and the integrated circuit chip and communicating with a second cavity forming an electromagnetic wave waveguide through a channel. 本公开的实施例涉及超高频电磁波发射/接收器件。本说明书涉及一种电磁波发射/接收器件,其包括:多层有机衬底、集成电路芯片、组装在多层有机衬底上的倒装芯片、包括第一腔体的封装,该第一腔体包含多层有机衬底和集成电路芯片,并且通过通道与形成电磁波波导的第二腔体连通。
Bibliography:Application Number: CN202210915317