High-thermal-conductivity rubber resin material and high-thermal-conductivity metal substrate

• Main Authors: LIU JIALIN, LIAO DECHAO, ZHOU SHIKAI, ZHANG HONGYI
• Format: Patent
• Language: Chinese; English
• Published: 10.02.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention discloses a high-thermal-conductivity rubber resin material and a high-thermal-conductivity metal substrate, and the high-thermal-conductivity rubber resin material comprises a high-thermal-conductivity rubber resin composition and an inorganic filler, the high-thermal-conductivity rubber resin composition comprises the following components in percentage by weight: 40 to 70 percent of liquid rubber, 10 to 30 percent of polyphenyl ether resin and 20 to 40 percent of cross-linking agent. Wherein the molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. Wherein the inorganic filler has at least one of an acryl group and a vinyl group after being subjected to a surface treatment procedure. 本发明公开一种高导热橡胶树脂材料及高导热金属基板，所述高导热橡胶树脂材料包括一高导热橡胶树脂组成物及一无机填料，所述高导热橡胶树脂组成物包括40重量百分比至70重量百分比的液态橡胶、10重量百分比至30重量百分比的聚苯醚树脂以及20重量百分比至40重量百分比的交联剂。其中，所述液态橡胶的分子量为800g/mol至6000g/mol。其中，所述无机填料经一表面处理程序，而具有压克力基和乙烯基中的至少一种。