Circuit board manufacturing method and multilayer circuit board

The invention is suitable for the technical field of circuit board manufacturing, and provides a circuit board manufacturing method and a multilayer circuit board, and the circuit board manufacturing method comprises the steps: carrying out the metallization of a buried hole on a substrate with the...

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Bibliographic Details
Main Authors LI WENGUAN, WU YONGHENG, CHEN XIAOQING
Format Patent
LanguageChinese
English
Published 03.02.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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