Circuit board manufacturing method and multilayer circuit board

• Main Authors: LI WENGUAN, WU YONGHENG, CHEN XIAOQING
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention is suitable for the technical field of circuit board manufacturing, and provides a circuit board manufacturing method and a multilayer circuit board, and the circuit board manufacturing method comprises the steps: carrying out the metallization of a buried hole on a substrate with the buried hole, enabling the hole wall of the buried hole to be plated with a metal coating, and enabling the substrate to comprise at least two metal layers, the buried hole penetrates through the substrate; filling the buried hole with a resin material; processing the resin material at the orifice of the buried hole; carrying out lamination layer-adding treatment on the substrate; the multilayer circuit board provided by the invention is manufactured by the circuit board manufacturing method; according to the invention, abnormal phenomena such as layering and foaming of the resin material and the dielectric layer are reduced. 本申请适用于电路板制造技术领域，提供一种电路板制造方法及多层电路板，其中电路板制造方法包括：对具有埋孔的基板进行所述埋孔的金属化，使所述埋孔的孔壁内镀有金属镀层，其中所述基板包括至少