QFN (Quad Flat No-lead) packaging method of power conversion module

• Main Author: LU JINFA
• Format: Patent
• Language: Chinese; English
• Published: 03.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention relates to the technical field of QFN packaging, discloses a QFN packaging method for a power conversion module, and solves the problems that the internal heat conduction effect of an existing QFN packaging structure is poor, and short circuit and unstable connection are easily caused...